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Semi-automatic Ultrasonic Processing Machine
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Semi-automatic Ultrasonic Processing Machine

Function:
☆ Stable ultrasonic energy output
☆ High central stability
☆ Pneumatic lifting
☆ On line grinding needle
☆ Low frequency needle changed
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Number of views:
1000
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Product description
Parameters

Function:

Stable ultrasonic energy output

High central stability

Pneumatic lifting

On line grinding needle

Low frequency needle changed

 

Specifications

Type

BDSA-CBE200/BDSA-CBE400

Recommend Scope

Φ0.05~Φ2.0mm/Φ0.3~Φ6.0mm

Needle Length

120mm

Ultrasonic Power

200W/400W

Ultrasonic Frequency

20kz

Power Supply Voltage

AC 220 V,50 Hz

Total Power

<600 W

Dimension(Length×Width×Height):

600mm×600 mm×950mm

Net Weight

about 150 kg

 

Main Features

Built with the latest ultrasonic frequency tracing technology;

Built with redesigned piezoelectric ceramic transducer;

Equipped with needle grinding machine;

High processing speed by fast switching performance between processing and needle grinding position;

Built with pressure monitor on the dies holder, making it easy for operation;

This universal machine is designed for shaping and polishing diamond dies that made from nature diamond, synthetic diamond, industrial ceramics and tungsten carbide.

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DMBEST DIAMOND DIE

ADD: No.5 Building,Huaxing Industrial Zone, No.2 Changsha Avenue, Yantai Economic & Technological Development Area Yantai City, Shandong Province, China.

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