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Feature
Double pillar structure
Double guide structure guanrantee better vibration straightness
Specifications
Type | BDXP-G |
Processing Scope | Φ0.5～Φ8.0 mm |
Die Holder Max.Incline Angle | 20° |
Power Supply Voltage | AC 220 V，50 Hz |
Total Power | ＜100 W |
Dimension(Length×Width×Height) | 600mm×600mm×550mm |
Net Weight | About 100kg |
Main Features
The driver system uses pulse width modulation technology; Ideally designed for processing fine size;
Double pillar structure with better vertical adjusting capabilities;
High finished grinding basement with better central adjustment capability;
High strength casting structure achieve better performance on stability, precision and service life;
This universal machine is designed for shaping and polishing diamond dies that made from nature diamond, synthetic diamond, industrial ceramics and tungsten carbide.
No evaluation information！