Grinding/Polishing Equipment

Grinding/Polishing Equipment

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Ultrasonic Processing Machine

Ultrasonic Processing Machine

  • Category:Grinding/Polishing Equipment
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  • Release time:2024-10-15 10:52:16
  • Product description

Features:

New design mold pallet system

Dust proof performance

Sensitive pressure transducer

 

Specifications

Type

BDC-50G/BDC-150F/BDC-300F

Recommend Scope

Φ0.03~Φ0.1mm/Φ0.05~Φ2mm/Φ0.3~Φ6.0mm

Needle Length

60mm

Ultrasonic Power

50W/150W/300W

Ultrasonic Frequency

20kz

Power Supply Voltage

AC 220 V,50 Hz

Total Power

<100W/300W/<400W

Dimension(Length×Width×Height)

Generator:250mm×410mm×410mm / Mechanical Part:350mm×290mm×500mm(BDC-50G)

Generator:420mm×250mm×420mm / Mechanical Part:410mm×455mm×610mm(BDC-150F/BDC-300F)

Net Weight

Generator:about 22kg / Mechanical Part:about 58 kg

Generator:about 25kg / Mechanical Part:about 58 kg

 

Main Features

Equipped with high power integrated amplifier circuit and next generation piezoelectric ceramic transducer;

The latest designed die holder improves the performance of dustproofing, which allows better pressure control during processing;

The machine is easy to operate and has long service life;

This universal machine is designed for shaping and polishing diamond dies that made from nature diamond, synthetic diamond, industrial ceramics and tungsten carbide.

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