Grinding/Polishing Equipment

Grinding/Polishing Equipment

current position: Home > Product Center > Grinding/Polishing Equipment
Semi-automatic Ultrasonic Processing Machine

Semi-automatic Ultrasonic Processing Machine

  • Category:Grinding/Polishing Equipment
  • Browse number:
  • QR code:
  • Release time:2025-02-18 13:20:18
  • Product description

Function:

Stable ultrasonic energy output

High central stability

Pneumatic lifting

On line grinding needle

Low frequency needle changed

 

Specifications

Type

BDSA-CBE200/BDSA-CBE400

Recommend Scope

Φ0.05~Φ2.0mm/Φ0.3~Φ6.0mm

Needle Length

120mm

Ultrasonic Power

200W/400W

Ultrasonic Frequency

20kz

Power Supply Voltage

AC 220 V,50 Hz

Total Power

<600 W

Dimension(Length×Width×Height):

600mm×600 mm×950mm

Net Weight

about 150 kg

 

Main Features

Built with the latest ultrasonic frequency tracing technology;

Built with redesigned piezoelectric ceramic transducer;

Equipped with needle grinding machine;

High processing speed by fast switching performance between processing and needle grinding position;

Built with pressure monitor on the dies holder, making it easy for operation;

This universal machine is designed for shaping and polishing diamond dies that made from nature diamond, synthetic diamond, industrial ceramics and tungsten carbide.

Tags

Recently Viewed:

Online evaluation (0)

    No evaluation information!

  • menu
#
在线客服

x