Automatic Ultrasonic Processing Machine
Function： ☆ Programming control ☆ Automatic needle grinding ☆ Automatic central ☆ Steady pressure monitoring ☆ Automatic processing ☆ Continuous processing
Semi-automatic Ultrasonic Processing Machine
Function： ☆ Stable ultrasonic energy output ☆ High central stability ☆ Pneumatic lifting ☆ On line grinding needle ☆ Low frequency needle changed
Automatic Teller Dies Machine
Feature： ☆ Automatic storage and retrieval functions ☆ Automatic dies recognition technology ☆ Various retrieval control options ☆ Big data analysis
Automatic Laser Marking Machine
Feature： ☆ Automatic two-dimensional code laser engraving system ; ☆ Automatic double-sided laser engraving system.
Semi-automatic Ultrasonic Shaping Machine
Function： ☆ High Power Integrated Amplifier Circuit ☆ Built with next generation piezoelectric ceramic transducer
Ultrasonic Processing Machine
Features： ☆ New design mold pallet system ☆ Dust proof performance ☆ Sensitive pressure transducer
Precision Wire Polishing Machine
Main Features The driver system uses pulse width modulation technology; Ideally designed for processing fine size ; Double pillar structure with better vertical adjusting capabilities; A longer working stroke with high production; Easy operation, low vibration and long term usage; This universal machine is designed for shaping and polishing fine size diamond dies that made from nature diamond, synthetic diamond, industrial ceramics and tungsten carbide.
Single Workstation Wire Polishing Machine
Feature Double pillar structure Double guide structure guanrantee better vibration straightness
Feature： ☆ Stable ultrasonic energy output ☆ High energy conversion efficiency
Wire Shrinking Machine
Main Features Built with three part speed gear; one machine that fits all diameters; Easy operation, high production efficiency
Welding Needle Machine
Main Features Built with safety, efficiency and eco-friendly; Easy operation.
Die Inspecting Microscope
Main Features Adjustable lighting; Easy operation and maintenance; This special microscope is designed for evaluation die surface and overall geometry profile.